Application

18661613 · METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS

Filed 2024-05-11 · Granted · Patent 12538830 (2026-01-27) The official file ↗The patent and its PDF ↗ · Art unit 1735 · Examiner Kiley Shawn Stoner Easy · CPC H10P 72/0428 · NCC NANO, LLC · STINSON LLP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

11.6 mo

to disposition 20.6 mo

Statutes raised

1 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.