Application

18688891 · KERNEL OF SPEAKER MODULE, SPEAKER MODULE, AND EARPHONE

Filed 2024-03-04 · Granted · Patent 12549904 (2026-02-10) The official file ↗The patent and its PDF ↗ · Art unit 2693 · Examiner William J Deane Jr Typical · CPC H04R 9/025 · Beijing Honor Device Co., Ltd. · WOMBLE BOND DICKINSON (US) LLP/Honor Device Co.,

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

19.5 mo

to disposition 23.3 mo

Statutes raised

0 actions read

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