PATLY.AIApplication
18692864 · Stamping Surface Profile in Design Layer and Using Patterned Electroplating Protection Structure for Defining Electroplating Structure on Seed Layer
Filed 2024-03-18 · Pending The official file ↗ · Art unit 1795 · Examiner Luan V Van Typical · CPC C25D 5/022 · AT&S Austria Technologie & Systemtechnik AG · SMITH TEMPEL BLAHA LLC
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