Application

18742056 · Interconnect Structure and Method of Forming Same

Filed 2024-06-13 · Granted · Patent 12550706 (2026-02-10) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner Phat X Cao Typical · CPC H10W 20/20 · Taiwan Semiconductor Manufacturing Co., Ltd. · Taiwan Semiconductor Manufacturing Co., Ltd.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

7.0 mo

to disposition 19.9 mo

Statutes raised

102 103 112 DP

2 actions read

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