Application

18804845 · FORMING SEMICONDUCTOR CHIP PACKAGE WITH A SACRIFICAL LAYER

Filed 2024-08-14 · Pending The official file ↗ · Art unit 2638 · Examiner Mekonnen D Dagnew Typical · CPC H10W 74/01 · TEXAS INSTRUMENTS INCORPORATED · TEXAS INSTRUMENTS INCORPORATED

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

24.1 mo

to disposition n/a

Statutes raised

0 actions read

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