Application

18880361 · POWER SEMICONDUCTOR DEVICE INCLUDING HEAT DISSIPATING STRUCTURE AND METHOD OF MANUFACTURING POWER SEMICONDUCTOR DEVICE

Filed 2024-12-31 · Pending The official file ↗ · Art unit 2897 · Examiner Sheng-Bai Zhu Hard · CPC H01L 23/4006 · Mitsubishi Electric Corporation · Xsensus

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

2.5 mo

to disposition n/a

Statutes raised

4 actions read

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