Application

18900000 · SEMICONDUCTOR DEVICE INCLUDING BOTTOM ISOLATION STRUCTURE FOR PREVENTING CURRENT LEAKAGE

Filed 2024-09-27 · Granted · Patent 12471365 (2025-11-11) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Mohammad M Choudhry Typical · CPC H10D 62/116 · SAMSUNG ELECTRONICS CO., LTD. · MYERS BIGEL, P.A.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

3.5 mo

to disposition 13.5 mo

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