Application

18907676 · ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MOLD FLASH AND METHODS FOR REDUCING ADHESION OF MOLD FLASH TO METAL LEADFRAMES

Filed 2024-10-07 · Pending The official file ↗ · Art unit 2817 · Examiner Mohammad M Hoque Typical · CPC H01L 23/49513 · ACULON, INC. · BLYNN L. SHIDELER

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

23.8 mo

to disposition n/a

Statutes raised

103

1 actions read

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