PATLY.AIApplication
18919934 · ELECTRONIC DEVICE HAVING A SUBSTRATE EMPLOYING REDUCED AREA, ADDED METAL PAD(S) TO METAL INTERCONNECT(S) TO REDUCE AIR VOIDS IN SOLDER JOINTS
Filed 2024-10-18 · Pending The official file ↗ · Art unit 2817 · Examiner Mrinal Bhatnagar · CPC H10W 70/611 · QUALCOMM Incorporated · W&T/Qualcomm
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