Application

18926674 · BONDING STRUCTURES FORMED USING SELECTIVE SURFACE TREATMENT OF COPPER BUMPS AND METHODS OF FORMING THE SAME

Filed 2024-10-25 · Pending The official file ↗ · Art unit 2817 · Examiner Benjamin Hoang Tran · CPC H10W 70/097 · Taiwan Semiconductor Manufacturing Company Limited · THE MARBURY LAW GROUP, PLLC

Office actions

first was

RCEs

no appeal

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n/a

to disposition n/a

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