PATLY.AIApplication
18932984 · METHOD OF FORMING REDISTRIBUTION PAD AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Filed 2024-10-31 · Pending The official file ↗ · Art unit 2898 · Examiner Pinaki Das Typical · CPC H10W 72/01938 · Samsung Electronics Co., Ltd. · Muir Patent Law, PLLC
Office actions
0
first was
RCEs
0
no appeal
To first action
n/a
to disposition n/a
Statutes raised
·
0 actions read