Application

18934389 · HEAT DISSIPATION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES

Filed 2024-11-01 · Pending The official file ↗ · Art unit 2893 · Examiner Christopher M Roland Hard · CPC H10W 40/22 · Taiwan Semiconductor Manufacturing Company, Ltd. · Haynes and Boone, LLP (24061)

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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