Patent AnalyticsExaminers
Menu

Application

18940222 · METAL INTERCONNECT STRUCTURES AND METHODS THEREOF

Filed 2024-11-07 · Pending The official file ↗ · Art unit 2893 · Examiner Vongsavanh Sengdara Hard · CPC H10W 20/4424 · Taiwan Semiconductor Manufacturing Company, Ltd. · FOLEY & LARDNER

Office actions
0
first was
RCEs
0
no appeal
To first action
n/a
to disposition n/a
Statutes raised
·
0 actions read
Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.

See plans Sign in