Application

18970731 · THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCTOR DEVICE MODULES

Filed 2024-12-05 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H01L 23/562 · SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · onsemi (BHB)

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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