Application

18992364 · METHOD FOR DRESSING POLISHING PAD, METHOD FOR POLISHING SILICON WAFER, METHOD FOR PRODUCING SILICON WAFER, AND DEVICE FOR POLISHING SILICON WAFER

Filed 2025-01-08 · Pending The official file ↗ · Art unit 3723 · Examiner Makena Markman Typical · CPC B24B 53/017 · SUMCO Corporation · GREENBLUM & BERNSTEIN, P.L.C.

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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