Application

19003731 · ADVANCED PACKAGING AND THERMAL SOLUTION DESIGNS FOR HIGH CURRENT DENSITY INTEGRATED CIRCUITS

Filed 2024-12-27 · Pending The official file ↗ · Art unit 2899 · Examiner Corbyn David Mellinger Typical · CPC H10W 40/40 · Adeia Semiconductor Bonding Technologies Inc. · HG Law LLP (Adeia)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

3.0 mo

to disposition n/a

Statutes raised

0 actions read

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