Application

19025256 · PACKAGE STRUCTURES

Filed 2025-01-16 · Granted · Patent 12557690 (2026-02-17) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Andres F Munoz Typical · CPC H10W 72/013 · Taiwan Semiconductor Manufacturing Company, Ltd. · TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

4.1 mo

to disposition 13.0 mo

Statutes raised

103 DP

1 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.