Application

19040693 · BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME

Filed 2025-01-29 · Granted · Patent 12557612 (2026-02-17) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner John P Dulka Typical · CPC H10P 72/0428 · Taiwan Semiconductor Manufacturing Co., Ltd. · Taiwan Semiconductor Manufacturing Co., Ltd.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

8.5 mo

to disposition 12.6 mo

Statutes raised

0 actions read

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