PATLY.AIApplication
19062467 · HIGH BANDWIDTH MEMORY STACK WITH SIDE EDGE INTERCONNECTION AND 3D IC STRUCTURE WITH THE SAME
Filed 2025-02-25 · Granted · Patent 12469836 (2025-11-11) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Jasmine Jhihan B Clark Easy · CPC H10B 80/00 · ETRON TECHNOLOGY, INC. · WPAT, PC
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first was Non-final rejection
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to disposition 8.5 mo
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