Application
19064511 · QUAD FLAT NO-LEAD (QFN) PACKAGE WITH TIE BARS AND DIRECT CONTACT INTERCONNECT BUILD-UP STRUCTURE AND METHOD FOR MAKING THE SAME
Filed 2025-02-26 · Granted · Patent 12500198 (2025-12-16) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner Jay C Chang Hard · CPC H10W 74/014 · Deca Technologies USA, Inc. · BOOTH UDALL, PLC
Office actions
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first was Non-final rejection
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1.8 mo
to disposition 9.6 mo
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