Application

19068370 · MOLDED DIRECT BONDED AND INTERCONNECTED STACK

Filed 2025-03-03 · Granted · Patent 12740490 (2026-09-15) The official file ↗The patent and its PDF ↗ · Art unit 2815 · Examiner Jose R Diaz Easy · CPC H10W 90/00 · ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. · Knobbe, Martens, Olson & Bear, LLP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

14.1 mo

to disposition 18.4 mo

Statutes raised

0 actions read

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