Application

19145142 · Electrodeposition of Thin Copper Films on Conductive Substrates

Filed 2025-07-01 · Pending The official file ↗ · Art unit 1795 · Examiner Azita Nouri · CPC H10P 14/47 · MacDermid Enthone Inc. · Element Solutions - Patents

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

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