Application
19153067 · THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MOLDED BODY
Filed 2025-08-01 · Pending The official file ↗ · Art unit · SEKISUI POLYMATECH CO., LTD. · WENDEROTH, LIND & PONACK, L.L.P.
Office actions
0
first was
RCEs
0
no appeal
To first action
n/a
to disposition n/a
Statutes raised
·
0 actions read