Application

19174268 · ADVANCED PACKAGING AND THERMAL SOLUTION DESIGNS FOR HIGH CURRENT DENSITY ICS

Filed 2025-04-09 · Pending The official file ↗ · Art unit 2899 · Examiner Zandra V Smith · CPC H10W 40/47 · Adeia Semiconductor Bonding Technologies Inc. · HG Law LLP (Adeia)

Office actions

first was Ex parte Quayle

RCEs

no appeal

To first action

4.8 mo

to disposition n/a

Statutes raised

0 actions read

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