Application

19178215 · STRUCTURES AND PROCESSES FOR ATTACHING COLD PLATES TO MULTI CHIP MODULES

Filed 2025-04-14 · Pending The official file ↗ · Art unit 2891 · Examiner David A Zarneke Typical · CPC H10W 40/237 · Adeia Semiconductor Bonding Technologies Inc. · HG Law LLP (Adeia)

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

9.2 mo

to disposition n/a

Statutes raised

0 actions read

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