Application

19180841 · MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED HIGH TEMPERATURE LOAD LIFE AND MOISTURE RESISTANCE RELIABILITY

Filed 2025-04-16 · Pending The official file ↗ · Art unit 2847 · Examiner Dion Ferguson Easy · CPC H01G 4/008 · SAMSUNG ELECTRO-MECHANICS CO., LTD. · Morgan, Lewis & Bockius LLP (WA)

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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