Application

19186366 · MULTI-DIE SEMICONDUCTOR WAFER USING SILICON WAFER SUBSTRATE EMBEDMENT

Filed 2025-04-22 · Granted · Patent 12532791 (2026-01-20) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Jasmine Jhihan B Clark Easy · CPC H10W 90/00 · Honeywell Federal Manufacturing & Technologies, LLC · Erise IP, P.A.

Office actions

first was Ex parte Quayle

RCEs

no appeal

To first action

2.9 mo

to disposition 9.0 mo

Statutes raised

0 actions read

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