Application
19213940 · BLADE DICING DEVICE FOR WAFERS
Filed 2025-05-20 · Granted · Patent 12444624 (2025-10-14) The official file ↗The patent and its PDF ↗ · Art unit 3723 · Examiner Robert F Neibaur Typical · CPC H10P 72/0428 · SP Semiconductor & Communication Co., Ltd. · CANTOR COLBURN LLP
Office actions
1
first was Non-final rejection
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0
no appeal
To first action
1.5 mo
to disposition 4.8 mo
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