Application

19268762 · CIRCUIT BOARD ASSEMBLY, METHOD OF MANUFACTURING CIRCUIT BOARD ASSEMBLY, CAMERA MODULE, PACKAGING METHOD OF CAMERA MODULE, AND ELECTRONIC DEVICE

Filed 2025-07-14 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H05K 1/184 · TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD. · ScienBiziP, PC

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.