Application

19274981 · Package with Improved Heat Dissipation Efficiency and Method for Forming the Same

Filed 2025-07-21 · Granted The official file ↗ · Art unit 2899 · Examiner Rohit Parthasarathy Typical · CPC H10W 40/47 · Taiwan Semiconductor Manufacturing Co., Ltd. · SLATER MATSIL, LLP/TSMC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

8.8 mo

to disposition 14.1 mo

Statutes raised

0 actions read

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