Application

19278363 · HEAT SINK STRUCTURE AND METHODS THEREOF

Filed 2025-07-23 · Granted · Patent 12713560 (2026-08-18) The official file ↗The patent and its PDF ↗ · Art unit 2841 · Examiner Mandeep S Buttar Typical · CPC H10W 40/47 · Taiwan Semiconductor Manufacturing Company, Ltd. · Haynes and Boone, LLP (24061)

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

9.1 mo

to disposition 12.8 mo

Statutes raised

0 actions read

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