Application

19278903 · METHODS FOR FABRICATING A MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH IMAGE SENSORS AND WAFER BONDING

Filed 2025-07-24 · Granted The official file ↗ · Art unit 2812 · Examiner Cheung Lee Easy · CPC H04N 25/585 · Monolithic 3D inc. · Monolithic3D

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

6.7 mo

to disposition 13.3 mo

Statutes raised

1 actions read

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