Application

19379772 · SENSOR PACKAGE STRUCTURE AND CHIP-SCALE SENSOR PACKAGE STRUCTURE

Filed 2025-11-05 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10F 39/804 · TONG HSING ELECTRONIC INDUSTRIES, LTD. · Li & Cai Intellectual Property Office

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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