Application

19411783 · SEMICONDUCTOR PACKAGE INCLUDING SOLDER BALL STRUCTURE

Filed 2025-12-08 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 70/099 · Samsung Electronics Co., Ltd. · HARNESS, DICKEY & PIERCE, P.L.C.

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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