Application

19438208 · DEVICE INTEGRATED WITH DEEP TRENCH ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREFOR

Filed 2025-12-31 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 10/014 · HANGZHOU FULLSEMI SEMICONDUCTOR CO., LTD. · SEED IP LAW GROUP LLP/GENERAL FIRM (EMAIL)

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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