PATLY.AIApplication
19459402 · PACKAGING STRUCTURE FOR A SURFACE-MOUNTING, POWER MODULE COMPRISING A PLURALITY OF SEMICONDUCTOR ELECTRONIC DEVICES
Filed 2026-01-26 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 40/235 · SHENZHEN STS MICROELECTRONICS CO., LTD. · Seed IP Law Group LLP/STMicroelectronics
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