Application

19535571 · SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

Filed 2026-02-10 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 70/65 · SAMSUNG ELECTRONICS CO., LTD. · SUGHRUE MION, PLLC

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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