Application

19546696 · POWER SEMICONDUCTOR PACKAGE INCLUDING STACKED CONTACT CLIPS, SYSTEM AND METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE

Filed 2026-02-23 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 72/07636 · Infineon Technologies AG · MURPHY, BILAK & HOMILLER/INFINEON TECHNOLOGIES

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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