PATLY.AIApplication
19555597 · INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR INTERFACING AN IC CHIP(S) TO A PACKAGE SUBSTRATE, AND RELATED METHODS
Filed 2026-03-03 · Pending The official file ↗ · Art unit 2899 · Examiner Evan Garrett Clinton Typical · CPC H10W 70/685 · QUALCOMM Incorporated · W&T/Qualcomm
Office actions
1
first was Non-final rejection
RCEs
1
no appeal
To first action
1.9 mo
to disposition n/a
Statutes raised
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0 actions read