Application
19559763 · ELECTRONIC PACKAGE MODULES WITH INTRA-MODULE ELECTROMAGNETIC INTERFERENCE SHIELDING
Filed 2026-03-06 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H05K 9/0024 · Skyworks Solutions, Inc. · Via LLP
Office actions
0
first was
RCEs
0
no appeal
To first action
n/a
to disposition n/a
Statutes raised
·
0 actions read