Application
19567435 · PHOTO DIODE WITH DUAL BACKSIDE DEEP TRENCH ISOLATION DEPTH
Filed 2026-03-16 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10F 39/807 · Taiwan Semiconductor Manufacturing Company, Ltd. · Eschweiler & Potashnik, LLC (TSMC)
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