Application

19568508 · LEADLESS SEMICONDUCTOR PACKAGE WITH DE-METALLIZED POROUS STRUCTURES AND METHOD FOR MANUFACTURING THE SAME

Filed 2026-03-16 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 70/457 · STMicroelectronics, Inc. · Seed IP Law Group LLP/STMicroelectronics

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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