Application

19581508 · SEED LAYER FORMATION METHOD, METAL INTERCONNECTION PROCESS METHOD, AND SEMICONDUCTOR PROCESS EQUIPMENT

Filed 2026-04-23 · Pending The official file ↗ · Art unit · BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. · Anova Law Group, PLLC

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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