PATLY.AIApplication
19621864 · PACKAGING STRUCTURE OF HALF-BRIDGE POWER MODULE, USE OF PACKAGING STRUCTURE OF HALF-BRIDGE POWER MODULE, AND MANUFACTURING METHOD FOR PACKAGING STRUCTURE OF HALF-BRIDGE POWER MODULE
Filed 2026-09-06 · Pending The official file ↗ · Art unit · SHANGHAI METAPWR ELECTRONICS CO., LTD · JCIPRNET
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