Application

19622673 · TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, METHOD FOR MANUFACTURING SAME, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTION FILM, TEMPORARILY PROTECTED ENCAPSULATION MOLDING OBJECT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Filed 2026-09-10 · Pending The official file ↗ · Art unit · Resonac Corporation · SOEI USA INC.

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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