Application

19628920 · HOTMELT CURABLE SILICONE COMPOSITION, ENCAPSULANT, HOTMELT ADHESIVE AND OPTICAL SEMICONDUCTOR DEVICE

Filed 2026-09-28 · Pending The official file ↗ · Art unit · Duroptix Materials Kabushiki Kaisha · Qnity

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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