Application

19635234 · Thermal Interface Material Assemblies

Filed 2026-03-31 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 40/226 · Laird Technologies (Shenzhen) Ltd. · Harness Dickey (St. Louis)

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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