Application

19637893 · SEMICONDUCTOR PACKAGE MANUFACTURING METHODS USING HYBRID DIE BONDING WITH SPIN-ON SILOXANE MATERIALS

Filed 2026-04-02 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC C09J 183/04 · Solstice Advanced Materials US, Inc. · SOLSTICE/FAEGRE DRINKER

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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