Application

19654046 · WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR

Filed 2026-04-21 · Pending The official file ↗ · Art unit 2811 · Examiner Docket Central Easy · CPC H10W 74/129 · STMICROELECTRONICS PTE LTD · Seed IP Law Group LLP/STMicroelectronics

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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