Application

19660002 · Power Semiconductor Apparatus and Bonding Method Thereof

Filed 2026-04-27 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 72/073 · Diodes Incorporated · AP3 Law Firm (Diodes)

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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